IEEE, the world´s largest technical professional organization dedicated to advancing technology for humanity, has announced the 2019 release of the Heterogeneous Integration Roadmap (HIR), a roadmap to the future of electronics identifying technology requirements and potential solutions, the company said.
The primary objective is to stimulate pre-competitive collaboration among industry, academia and government to accelerate progress.
The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines.
The electronics industry relies on the integration of separately manufactured components into higher-level assemblies to enable enhanced functionality and operations. This heterogeneous integration of wireless and mixed signal devices, bio-chips, power devices, optoelectronics and microelectromechanical systems in a single package places new requirements on the electronics industry as these diverse components are introduced into System-in-Package (SiP) architectures for the tremendous array of industries where electronics are used.
The 2019 edition of the Heterogeneous Integration Roadmap includes 22 chapters and can be downloaded by visiting https://eps.ieee.org/technology/heterogeneous-integration-roadmap/2019-edition.html. Additional chapters currently under peer review will be made available upon final approval.
The HIR is sponsored by the IEEE Electronics Packaging Society (EPS), SEMI, the IEEE Electron Devices Society (EDS), the IEEE Photonics Society and The American Society of Mechanical Engineers (ASME EPPD Division). For stakeholders interested in contributing to the 2020 Heterogeneous Integration Roadmap, visit the roadmap´s member page.
The IEEE Electronics Packaging Society is the international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. The Society promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations. Learn more at http://eps.ieee.org.
IEEE is the world´s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice in a wide variety of areas ranging from aerospace systems, computers, and telecommunications to biomedical engineering, electric power, and consumer electronics. Learn more at http://www.ieee.org.
