Molex, a global manufacturer of electronic solutions, has become a member of the 2017 Open Networking Users Group (ONUG), the company said.
A coalition of industry leaders, IT end users and open source professionals, ONUG members leverage their collective expertise, engineering, manufacturing and procurement power to influence the pace and deployment of open networking solutions.
ONUG hosts an annual Spring and Fall Conference, Working Groups and Open IT Framework Industry Initiatives. Molex plans to attend the upcoming ONUG Spring 2017 Conference being held April 25th and 26th at the UCSF Mission Bay Conference Center in San Francisco.
The ONUG Spring 2017 Conference agenda features keynote addresses, panel discussions, real-world case studies, concept presentations, and a technology showcase designed to highlight interoperability demonstrations. Conference themes include building hybrid cloud infrastructure to address security, retooling operational teams, and restructuring the IT culture for new paradigms in cloud-based infrastructure.
Through innovation and industry partnerships, Molex strives to increase the availability of higher density, higher speed connectivity solutions that support next-generation networking, computing and storage architectures to 100G today with a roadmap to 400G and beyond. The company is an industry leader in R&D investment.
Developing solutions to meet tomorrow´s demands, Molex supports a wide range of IT applications, including hyper scale and enterprise data centers, Web 2.0, big data, high performance computing (HPC) and embedded markets. Molex solutions are designed to provide high levels of reliability, quality and scalability, benefiting customers in the areas of computing and network performance, density, thermal management and power efficiency.
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle.