Bsquare reports new board support package for TI OMAP 4 platform

Bsquare Corp. (NASDAQ: BSQR) has announced the availability of a new Bsquare board support package (BSP) for the Texas Instruments OMAP 4 platform which will enable streamlined development on this high-performance TI platform.

The BSP empowers developers to build solutions using Windows Embedded Compact 7. The release targets the OMAP 4470 Blaze MDP reference platform.

Bsquare, a leader in embedded solutions, applies experience and expertise on leading platforms to create new connections with customers, new business models and to enable new ways of working and communicating. Bsquare serves customers by forging connections among the partners, people, tools, and technology needed to create smart connected systems. For more information, visit www.bsquare.com.

0saves
If you enjoyed this post, please consider leaving a comment or subscribing to the RSS feed to have future articles delivered to your feed reader.

Comments are closed.

Powered by WordPress